TLC2272MJGB vs LMC6062IN feature comparison

TLC2272MJGB Rochester Electronics LLC

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LMC6062IN National Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.0008 µA 0.000004 µA
Common-mode Reject Ratio-Nom 80 dB 85 dB
Input Offset Voltage-Max 3000 µV 1300 µV
JESD-30 Code R-GDIP-T8 R-PDIP-T8
Length 9.58 mm 9.817 mm
Moisture Sensitivity Level NOT SPECIFIED 1
Neg Supply Voltage Limit-Max -8 V
Neg Supply Voltage-Nom (Vsup) -5 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Nom 3.6 V/us 35000 V/us
Supply Voltage Limit-Max 8 V 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NOT SPECIFIED Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Unity Gain BW-Nom 2250 100
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.33.00.01
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 63 dB
Frequency Compensation YES
JESD-609 Code e0
Low-Bias YES
Low-Offset NO
Micropower YES
Package Equivalence Code DIP8,.3
Packing Method RAIL
Qualification Status Not Qualified
Slew Rate-Min 0.007 V/us
Supply Current-Max 0.066 mA
Voltage Gain-Min 35000

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