TLC2274AID
vs
LPV358MMX/NOPB
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
MSOP
|
| Package Description |
GREEN, PLASTIC, MS-012AB, SOIC-14
|
MSOP-8
|
| Pin Count |
14
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0008 µA
|
0.06 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
71 dB
|
| Input Offset Voltage-Max |
1500 µV
|
10000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
S-PDSO-G8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
8.65 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
-8 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.75 mm
|
1.09 mm
|
| Slew Rate-Nom |
3.6 V/us
|
0.1 V/us
|
| Supply Voltage Limit-Max |
8 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Unity Gain BW-Nom |
2250
|
152
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TLC2274AID with alternatives
Compare LPV358MMX/NOPB with alternatives