TLC271BIDR
vs
OPA2340PA
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
GREEN, PLASTIC, MS-012AA, SOIC-8
|
DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.00006 µA
|
0.00006 µA
|
| Bias Current-Max (IIB) @25C |
0.00006 µA
|
0.00001 µA
|
| Common-mode Reject Ratio-Min |
65 dB
|
80 dB
|
| Common-mode Reject Ratio-Nom |
80 dB
|
92 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Current-Max (IIO) |
0.00006 µA
|
0.00001 µA
|
| Input Offset Voltage-Max |
2000 µV
|
500 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4.9 mm
|
9.81 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
YES
|
| Micropower |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
TR
|
TUBE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power |
NO
|
NO
|
| Programmable Power |
YES
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Slew Rate-Nom |
3.6 V/us
|
6 V/us
|
| Supply Current-Max |
1.6 mA
|
1.9 mA
|
| Supply Voltage Limit-Max |
18 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
2000
|
5500
|
| Voltage Gain-Min |
10000
|
50000
|
| Wideband |
NO
|
NO
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare TLC271BIDR with alternatives
Compare OPA2340PA with alternatives