TLC27L9IDRG4
vs
LMC6484IM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP14,.25
|
,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.002 µA
|
|
| Common-mode Reject Ratio-Min |
65 dB
|
|
| Common-mode Reject Ratio-Nom |
94 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
2000 µV
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e4
|
|
| Length |
8.65 mm
|
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Packing Method |
TAPE AND REEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Slew Rate-Nom |
0.03 V/us
|
|
| Supply Current-Max |
0.172 mA
|
|
| Supply Voltage Limit-Max |
18 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Unity Gain BW-Nom |
85
|
|
| Voltage Gain-Min |
50000
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
4
|
|
|
|
Compare TLC27L9IDRG4 with alternatives
Compare LMC6484IM with alternatives