TLC5943PWPG4
vs
IS31FL3726-QFLS2-TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
LUMISSIL MICROSYSTEMS
|
| Part Package Code |
SSOP
|
|
| Package Description |
HTSSOP, TSSOP28,.25
|
HVQCCN, LCC24,.16SQ,20
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
R-PDSO-G28
|
S-XQCC-N24
|
| JESD-609 Code |
e4
|
|
| Length |
9.7 mm
|
4 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Segments |
16
|
16
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP28,.25
|
LCC24,.16SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3.3 V
|
3.3 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
4 mm
|
| fmax-Min |
30 MHz
|
20 MHz
|
| Base Number Matches |
1
|
2
|
| Technology |
|
CMOS
|
|
|
|
Compare TLC5943PWPG4 with alternatives
Compare IS31FL3726-QFLS2-TR with alternatives