TLC6C5724QDAPRQ1
vs
TB62D787FTG
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TOSHIBA CORP
|
Package Description |
HTSSOP-38
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2018-09-06
|
2017-03-09
|
Samacsys Manufacturer |
Texas Instruments
|
Toshiba
|
Data Input Mode |
SERIAL
|
SERIAL
|
Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
JESD-30 Code |
R-PDSO-G38
|
S-PQCC-N40
|
JESD-609 Code |
e4
|
|
Length |
12.5 mm
|
6 mm
|
Moisture Sensitivity Level |
3
|
|
Multiplexed Display Capability |
NO
|
|
Number of Channels |
24
|
|
Number of Functions |
1
|
1
|
Number of Segments |
24
|
24
|
Number of Terminals |
38
|
40
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
HVQCCN
|
Package Equivalence Code |
TSSOP38,.32
|
LCC40,.24SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.2 mm
|
0.9 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
6.1 mm
|
6 mm
|
fmax-Min |
4 MHz
|
2 MHz
|
Base Number Matches |
2
|
1
|
Supply Voltage1-Max |
|
28 V
|
Supply Voltage1-Min |
|
7 V
|
Supply Voltage1-Nom |
|
15 V
|
Technology |
|
BICMOS
|
|
|
|