TLE2022MFKB
vs
AD744CQ
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QLCC
|
DIP
|
Package Description |
CERAMIC, LCC-20
|
HERMETIC SEALED, CERDIP-8
|
Pin Count |
20
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
0.09 µA
|
0.0001 µA
|
Common-mode Reject Ratio-Nom |
106 dB
|
84 dB
|
Input Offset Voltage-Max |
700 µV
|
450 µV
|
JESD-30 Code |
S-CQCC-N20
|
R-GDIP-T8
|
Length |
8.89 mm
|
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
Neg Supply Voltage Limit-Max |
-20 V
|
-18 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
2
|
1
|
Number of Terminals |
20
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCN
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
2.03 mm
|
5.08 mm
|
Slew Rate-Nom |
0.65 V/us
|
75 V/us
|
Supply Voltage Limit-Max |
20 V
|
18 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NOT SPECIFIED
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Total Dose |
MIL-STD-883 V
|
|
Unity Gain BW-Nom |
2800
|
13000
|
Width |
8.89 mm
|
7.62 mm
|
Base Number Matches |
2
|
2
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
COMMERCIAL
|
|
|
|
Compare TLE2022MFKB with alternatives
Compare AD744CQ with alternatives