TLE2061MD
vs
TL061ACD
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, MS-012AA, SOIC-8
|
PLASTIC, SOP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.03 µA
|
0.007 µA
|
| Common-mode Reject Ratio-Nom |
82 dB
|
84 dB
|
| Input Offset Voltage-Max |
6000 µV
|
7500 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-19 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
|
| Slew Rate-Nom |
3.4 V/us
|
6 V/us
|
| Supply Voltage Limit-Max |
19 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIFET
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
1300
|
2000
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
5
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
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