TLE6250GNTMA1 vs 1000BM2 feature comparison

TLE6250GNTMA1 Infineon Technologies AG

Buy Now Datasheet

1000BM2 LSI Corporation

Buy Now Datasheet
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG AT & T MICROELECTRONICS
Part Package Code SOIC
Package Description SOP, ,
Pin Count 8
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 S-PQCC-J44
Length 5 mm
Number of Functions 1 1
Number of Terminals 8 44
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BICMOS
Telecom IC Type CAN TRANSCEIVER INTERFACE CIRCUIT
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm
Terminal Position DUAL QUAD
Width 4 mm
Base Number Matches 1 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL

Compare TLE6250GNTMA1 with alternatives

Compare 1000BM2 with alternatives