TLE6250GV33XT
vs
S2104TB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
APPLIED MICRO CIRCUITS CORP
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
SOP,
|
LBGA,
|
| Pin Count |
8
|
208
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
53 Weeks, 1 Day
|
|
| JESD-30 Code |
R-PDSO-G8
|
S-PBGA-B208
|
| Length |
5 mm
|
23 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
208
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.65 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
CAN TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4 mm
|
23 mm
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare TLE6250GV33XT with alternatives
Compare S2104TB with alternatives