TLE6251-3G vs TJA1041AT/M,112 feature comparison

TLE6251-3G Infineon Technologies AG

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TJA1041AT/M,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Samacsys Manufacturer Infineon
Data Rate 1000 Mbps
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.75 mm 8.65 mm
Moisture Sensitivity Level 2A
Number of Functions 1 1
Number of Terminals 14 14
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Current-Max 0.08 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BICMOS
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4 mm 3.9 mm
Base Number Matches 1 1
Manufacturer Package Code SOT108-1

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