TLE6251DSXUMA2/SAMPLE
vs
TJA1043TKY
feature comparison
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SON
|
| Package Description |
|
3 X 4.50 MM, 0.85 MM HEIGHT,GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
|
| Pin Count |
|
14
|
| Manufacturer Package Code |
|
SOT1086-2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Data Rate |
|
1000 Mbps
|
| JESD-30 Code |
|
R-PDSO-G14
|
| JESD-609 Code |
|
e4
|
| Length |
|
4.5 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
14
|
| Number of Transceivers |
|
1
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVSSOP
|
| Package Equivalence Code |
|
SOLCC14,.12,25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
65 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3 mm
|
|
|
|
Compare TLE6251DSXUMA2/SAMPLE with alternatives
Compare TJA1043TKY with alternatives