TLE9250LEXUMA1
vs
1000BM2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
AT & T MICROELECTRONICS
|
| Package Description |
HTSON,
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
39 Weeks
|
|
| Samacsys Manufacturer |
Infineon
|
|
| JESD-30 Code |
S-PDSO-N8
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
2A
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
44
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSON
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare TLE9250LEXUMA1 with alternatives
Compare 1000BM2 with alternatives