TLE9255WSKXUMA2
vs
TJA1041T/CM,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Package Description |
SOP,
|
3.90 MM, PLASTIC, SOT-108-1, SOP-14
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
53 Weeks, 1 Day
|
10 Weeks
|
| Samacsys Manufacturer |
Infineon
|
NXP
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
e4
|
| Length |
8.75 mm
|
8.65 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
Tin (Sn)
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Manufacturer Package Code |
|
SOT108-1
|
|
|
|
Compare TLE9255WSKXUMA2 with alternatives
Compare TJA1041T/CM,118 with alternatives
-
TJA1041T/CM,118 vs SP000407102
-
TJA1041T/CM,118 vs 935224900118
-
TJA1041T/CM,118 vs TLE6251-3G
-
TJA1041T/CM,118 vs TLE6253G
-
TJA1041T/CM,118 vs 935285277118
-
TJA1041T/CM,118 vs 935263364027
-
TJA1041T/CM,118 vs TJA1054AT/M,518
-
TJA1041T/CM,118 vs 935278812118
-
TJA1041T/CM,118 vs TLE9251VLEXUMA1