TLE9255WSKXUMA2
vs
TJA1043TKY
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
Package Description |
SOP,
|
3 X 4.50 MM, 0.85 MM HEIGHT,GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
53 Weeks, 1 Day
|
4 Weeks
|
Samacsys Manufacturer |
Infineon
|
NXP
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
e4
|
Length |
8.75 mm
|
4.5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
14
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
1.75 mm
|
1 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Tin (Sn)
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
4 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SON
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT1086-2
|
ECCN Code |
|
EAR99
|
Data Rate |
|
1000 Mbps
|
Number of Transceivers |
|
1
|
Package Equivalence Code |
|
SOLCC14,.12,25
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
65 mA
|
|
|
|
Compare TLE9255WSKXUMA2 with alternatives
Compare TJA1043TKY with alternatives