TLV2262MJG vs TS272BIN feature comparison

TLV2262MJG Texas Instruments

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TS272BIN STMicroelectronics

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.0008 µA 0.0003 µA
Common-mode Reject Ratio-Nom 75 dB 80 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 3000 µV 3000 µV
JESD-30 Code R-GDIP-T8 R-PDIP-T8
Length 9.58 mm
Low-Bias YES YES
Low-Offset NO NO
Micropower YES NO
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Min 0.3 V/us
Slew Rate-Nom 0.55 V/us 5.5 V/us
Supply Current-Max 0.5 mA 3.4 mA
Supply Voltage Limit-Max 16 V 18 V
Supply Voltage-Nom (Vsup) 3 V 10 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 670 3500
Voltage Gain-Min 25000 6000
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
JESD-609 Code e3
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Power NO
Programmable Power NO
Terminal Finish MATTE TIN
Wideband NO

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