TLV2316QDGKRQ1
vs
TLV2316IDGKT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
VSSOP-8
|
TSSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Date Of Intro |
2016-12-25
|
2016-02-21
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common-mode Reject Ratio-Min |
72 dB
|
72 dB
|
| Common-mode Reject Ratio-Nom |
90 dB
|
90 dB
|
| Input Offset Voltage-Max |
3000 µV
|
3000 µV
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Slew Rate-Nom |
6 V/us
|
6 V/us
|
| Supply Current-Max |
1150 mA
|
1150 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Unity Gain BW-Nom |
10000
|
10000
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TLV2316QDGKRQ1 with alternatives
Compare TLV2316IDGKT with alternatives