TLV2401CDBV
vs
TLV2401IDBVTG4
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOT-23
|
SOT-23
|
| Package Description |
LSSOP, TSOP5/6,.11,37
|
LSSOP, TSOP5/6,.11,37
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00035 µA
|
0.0009 µA
|
| Common-mode Reject Ratio-Nom |
120 dB
|
120 dB
|
| Input Offset Voltage-Max |
1500 µV
|
1200 µV
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| Length |
2.9 mm
|
2.9 mm
|
| Neg Supply Voltage Limit-Max |
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.45 mm
|
1.45 mm
|
| Slew Rate-Nom |
2500 V/us
|
0.0025 V/us
|
| Supply Voltage Limit-Max |
17 V
|
17 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
5.5
|
5.5
|
| Width |
1.65 mm
|
1.6 mm
|
| Base Number Matches |
5
|
1
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.0003 µA
|
| Common-mode Reject Ratio-Min |
|
70 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Current-Max (IIO) |
|
0.00025 µA
|
| JESD-609 Code |
|
e4
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Supply Current-Max |
|
0.00095 mA
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Voltage Gain-Min |
|
130000
|
| Wideband |
|
NO
|
|
|
|
Compare TLV2401CDBV with alternatives
Compare TLV2401IDBVTG4 with alternatives