TLV2462AMDREP
vs
TLV2462AMUB
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
GREEN, PLASTIC, SOIC-8
|
QFF, FL10,.24
|
| Pin Count |
8
|
10
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.075 µA
|
0.075 µA
|
| Bias Current-Max (IIB) @25C |
0.014 µA
|
0.014 µA
|
| Common-mode Reject Ratio-Min |
71 dB
|
71 dB
|
| Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Current-Max (IIO) |
0.007 µA
|
0.007 µA
|
| Input Offset Voltage-Max |
1500 µV
|
1500 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-GDFP-F10
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4.9 mm
|
6.475 mm
|
| Low-Bias |
NO
|
NO
|
| Low-Offset |
NO
|
NO
|
| Micropower |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
QFF
|
| Package Equivalence Code |
SOP8,.25
|
FL10,.24
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Packing Method |
TR
|
TUBE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.03 mm
|
| Slew Rate-Min |
0.8 V/us
|
0.8 V/us
|
| Slew Rate-Nom |
1.6 V/us
|
1.6 V/us
|
| Supply Current-Max |
1.3 mA
|
1.3 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
6400
|
6400
|
| Voltage Gain-Min |
31622
|
31622
|
| Wideband |
NO
|
NO
|
| Width |
3.905 mm
|
6.225 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare TLV2462AMDREP with alternatives
Compare TLV2462AMUB with alternatives