TLV2462AMJGB
vs
TLV2462AMDREP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP8,.3
|
GREEN, PLASTIC, SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.075 µA
|
0.075 µA
|
| Bias Current-Max (IIB) @25C |
0.014 µA
|
0.014 µA
|
| Common-mode Reject Ratio-Min |
71 dB
|
71 dB
|
| Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Current-Max (IIO) |
0.007 µA
|
0.007 µA
|
| Input Offset Voltage-Max |
1500 µV
|
1500 µV
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
9.58 mm
|
4.9 mm
|
| Low-Bias |
NO
|
NO
|
| Low-Offset |
NO
|
NO
|
| Micropower |
NO
|
NO
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Packing Method |
TUBE
|
TR
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Slew Rate-Min |
0.8 V/us
|
0.8 V/us
|
| Slew Rate-Nom |
1.6 V/us
|
1.6 V/us
|
| Supply Current-Max |
1.3 mA
|
1.3 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Unity Gain BW-Nom |
6400
|
6400
|
| Voltage Gain-Min |
31622
|
31622
|
| Wideband |
NO
|
NO
|
| Width |
7.62 mm
|
3.905 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare TLV2462AMJGB with alternatives
Compare TLV2462AMDREP with alternatives