TLV2464CPW
vs
TLE2022BMFKB
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
QLCC
|
| Package Description |
GREEN, PLASTIC, TSSOP-14
|
CERAMIC, LCC-20
|
| Pin Count |
14
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.025 µA
|
0.09 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
112 dB
|
| Input Offset Voltage-Max |
2200 µV
|
300 µV
|
| JESD-30 Code |
R-PDSO-G14
|
S-CQCC-N20
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
8.89 mm
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSSOP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Seated Height-Max |
1.2 mm
|
2.03 mm
|
| Slew Rate-Nom |
1.6 V/us
|
0.65 V/us
|
| Supply Voltage Limit-Max |
6 V
|
20 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NOT SPECIFIED
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
5200
|
2800
|
| Width |
4.4 mm
|
8.89 mm
|
| Base Number Matches |
2
|
2
|
| Neg Supply Voltage Limit-Max |
|
-20 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
|
|
|
Compare TLV2464CPW with alternatives
Compare TLE2022BMFKB with alternatives