TLV2475CPWP
vs
TLV2475IPWPG4
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
PLASTIC, HTSSOP-16
|
TSSOP, TSSOP16,.25
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.0003 µA
|
| Common-mode Reject Ratio-Nom |
78 dB
|
78 dB
|
| Input Offset Voltage-Max |
2400 µV
|
2400 µV
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
NOT SPECIFIED
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Slew Rate-Nom |
1.4 V/us
|
1.4 V/us
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
2800
|
2800
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.00005 µA
|
| Frequency Compensation |
|
YES
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Packing Method |
|
TUBE
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Slew Rate-Min |
|
0.6 V/us
|
| Supply Current-Max |
|
4 mA
|
| Voltage Gain-Min |
|
25000
|
| Wideband |
|
NO
|
|
|
|
Compare TLV2475CPWP with alternatives
Compare TLV2475IPWPG4 with alternatives