TLV314IDBVR
vs
MCP6273T-E/MS
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SOT-23, 5 PIN
|
TSSOP, TSSOP8,.19
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2016-03-23
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common-mode Reject Ratio-Min |
72 dB
|
65 dB
|
| Common-mode Reject Ratio-Nom |
96 dB
|
85 dB
|
| Input Offset Voltage-Max |
3000 µV
|
5000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.45 mm
|
1.1 mm
|
| Slew Rate-Nom |
1.5 V/us
|
0.9 V/us
|
| Supply Current-Max |
0.25 mA
|
0.24 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Unity Gain BW-Nom |
3000
|
2000
|
| Width |
1.6 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
MSOP
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Factory Lead Time |
|
5 Weeks
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.005 µA
|
| Frequency Compensation |
|
YES
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Packing Method |
|
TAPE AND REEL
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Voltage Gain-Min |
|
31620
|
| Wideband |
|
NO
|
|
|
|
Compare TLV314IDBVR with alternatives
Compare MCP6273T-E/MS with alternatives