TLV314QDBVTQ1
vs
MCP6271-E/P
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SOT-23, 5 PIN
|
0.300 INCH, PLASTIC, DIP-8
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2016-12-09
|
|
Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Common-mode Reject Ratio-Min |
72 dB
|
65 dB
|
Common-mode Reject Ratio-Nom |
96 dB
|
85 dB
|
Input Offset Voltage-Max |
3000 µV
|
5000 µV
|
JESD-30 Code |
R-PDSO-G5
|
R-PDIP-T8
|
JESD-609 Code |
e4
|
e3
|
Length |
2.9 mm
|
9.27 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
5
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.45 mm
|
5.334 mm
|
Slew Rate-Nom |
1.5 V/us
|
0.9 V/us
|
Supply Current-Max |
0.25 mA
|
0.24 mA
|
Supply Voltage Limit-Max |
7 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.95 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Unity Gain BW-Nom |
3000
|
2000
|
Width |
1.6 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Factory Lead Time |
|
4 Weeks
|
Architecture |
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
|
0.005 µA
|
Frequency Compensation |
|
YES
|
Low-Bias |
|
YES
|
Low-Offset |
|
NO
|
Micropower |
|
YES
|
Package Equivalence Code |
|
DIP8,.3
|
Packing Method |
|
TUBE
|
Power |
|
NO
|
Programmable Power |
|
NO
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Voltage Gain-Min |
|
31620
|
Wideband |
|
NO
|
|
|
|
Compare TLV314QDBVTQ1 with alternatives
Compare MCP6271-E/P with alternatives