TLV320AIC1110GQER
vs
LE58QL061BVC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
LEGERITY INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
PLASTIC, MICRO, BGA-80
|
TQFP,
|
Pin Count |
80
|
44
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Companding Law |
A/MU-LAW
|
A/MU-LAW
|
Filter |
YES
|
YES
|
Gain Tolerance-Max |
1 dB
|
|
JESD-30 Code |
S-PBGA-B80
|
S-PQFP-G44
|
JESD-609 Code |
e0
|
e3
|
Length |
5 mm
|
10 mm
|
Linear Coding |
15-BIT
|
|
Moisture Sensitivity Level |
2A
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
80
|
44
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TQFP
|
Package Equivalence Code |
BGA80,9X9,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE
|
Peak Reflow Temperature (Cel) |
235
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Supply Current-Max |
0.006 mA
|
|
Supply Voltage-Nom |
3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
5 mm
|
10 mm
|
Base Number Matches |
1
|
4
|
|
|
|
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