TLV4011QDCKRQ1
vs
TLV4021R1YKAR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
TSSOP, TSSOP5/6,.08
|
VFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2020-09-17
|
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.025 µA
|
|
Bias Current-Max (IIB) @25C |
0.025 µA
|
0.005 µA
|
Input Offset Voltage-Max |
9000 µV
|
4000 µV
|
JESD-30 Code |
R-PDSO-G5
|
S-XBGA-B4
|
JESD-609 Code |
e4
|
e1
|
Length |
2 mm
|
0.73 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
5
|
4
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP5/6,.08
|
BGA4,2X2,14
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Response Time-Nom |
5000 ns
|
360 ns
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.1 mm
|
0.4 mm
|
Supply Current-Max |
0.004 mA
|
0.005 mA
|
Supply Voltage Limit-Max |
7 V
|
6 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.35 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
1.25 mm
|
0.73 mm
|
Base Number Matches |
1
|
1
|
Packing Method |
|
TR, 7 INCH
|
|
|
|
Compare TLV4011QDCKRQ1 with alternatives
Compare TLV4021R1YKAR with alternatives