TMP68881YC-12 vs TS68882MF8B/Y20 feature comparison

TMP68881YC-12 Toshiba America Electronic Components

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TS68882MF8B/Y20 Thales Group

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP THOMSON-CSF SEMICONDUCTORS
Part Package Code PGA QFP
Package Description PGA, ,
Pin Count 68 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Boundary Scan NO
Clock Frequency-Max 12.5 MHz
External Data Bus Width 32
JESD-30 Code S-CPGA-P68 S-CQFP-G68
Length 26.92 mm
Number of Terminals 68 68
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.59 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR QUAD
Width 26.92 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 1 3
ECCN Code 3A001.A.2.C
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Screening Level CECC90000B
Temperature Grade MILITARY

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Compare TS68882MF8B/Y20 with alternatives