TMP68881YC-12
vs
TS68882MF8B/Y20
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
THOMSON-CSF SEMICONDUCTORS
|
Part Package Code |
PGA
|
QFP
|
Package Description |
PGA,
|
,
|
Pin Count |
68
|
68
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
12.5 MHz
|
|
External Data Bus Width |
32
|
|
JESD-30 Code |
S-CPGA-P68
|
S-CQFP-G68
|
Length |
26.92 mm
|
|
Number of Terminals |
68
|
68
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.59 mm
|
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
PIN/PEG
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
PERPENDICULAR
|
QUAD
|
Width |
26.92 mm
|
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
Base Number Matches |
1
|
3
|
ECCN Code |
|
3A001.A.2.C
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Screening Level |
|
CECC90000B
|
Temperature Grade |
|
MILITARY
|
|
|
|
Compare TMP68881YC-12 with alternatives
Compare TS68882MF8B/Y20 with alternatives