TMP82C37BP-8
vs
KS82C37A-8IP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP, DIP40,.6
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
SINGLE/BLOCK/DEMAND XFR MODES; FIXED & ROTATIONAL PRI INTRPT MODES; DATA XFR RATE [MBYTES/SEC.] = 8
|
|
| Address Bus Width |
16
|
8
|
| Bus Compatibility |
8085
|
8080; 8085; 8086; 8088; 80186; 80286; 80386
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
| Length |
50.7 mm
|
52.197 mm
|
| Number of DMA Channels |
4
|
4
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.8 mm
|
5.08 mm
|
| Supply Current-Max |
16 mA
|
16 mA
|
| Supply Voltage-Max |
5.5 V
|
6 V
|
| Supply Voltage-Min |
4.5 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
DMA CONTROLLER
|
DMA CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP40,.6
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TMP82C37BP-8 with alternatives
Compare KS82C37A-8IP with alternatives