TMS320C6211GFN-167
vs
TMS320C6711BGFN150
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
27 X 27 MM, PLASTIC, BGA-256
|
27 X 27 MM, PLASTIC, BGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
22
|
22
|
Barrel Shifter |
NO
|
NO
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
166.67 MHz
|
149.25 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
27 mm
|
27 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
90 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
2.32 mm
|
2.32 mm
|
Supply Voltage-Max |
1.89 V
|
2 V
|
Supply Voltage-Min |
1.71 V
|
1.8 V
|
Supply Voltage-Nom |
1.8 V
|
1.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
4
|
Peak Reflow Temperature (Cel) |
|
220
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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