TMS320DM355DZCEA21 vs TMS320DM355DZCE270 feature comparison

TMS320DM355DZCEA21 Texas Instruments

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TMS320DM355DZCE270 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LFBGA, BGA337,19X19,25 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, NFBGA-337
Pin Count 337 337
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Additional Feature IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
Bit Size 32 32
Bus Compatibility I2C; SPI; UART; USB I2C; SPI; UART; USB
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
JESD-30 Code S-PBGA-B337 S-PBGA-B337
JESD-609 Code e1 e1
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Terminals 337 337
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA337,19X19,25 BGA337,19X19,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (words) 8192 8192
Seated Height-Max 1.3 mm 1.3 mm
Supply Voltage-Max 1.365 V 1.365 V
Supply Voltage-Min 1.235 V 1.235 V
Supply Voltage-Nom 1.3 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 13 mm
uPs/uCs/Peripheral ICs Type Digital Media SoC Digital Media SoC
Base Number Matches 1 1