TNY263P vs TEA1622P/N1,112 feature comparison

TNY263P Power Integrations

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TEA1622P/N1,112 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer POWER INTEGRATIONS INC NXP SEMICONDUCTORS
Part Package Code DIP MO-001
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature REQUIRES AN AC SUPPLY OF 85 TO 265 V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT SWITCHING REGULATOR
Control Mode CURRENT-MODE VOLTAGE-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
JESD-30 Code R-PDIP-T7 R-PDIP-T8
JESD-609 Code e0 e4
Length 9.575 mm 9.5 mm
Number of Functions 1 1
Number of Terminals 7 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -20 °C
Output Current-Max 0.4 A 1 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP7/8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Switcher Configuration SINGLE SINGLE
Switching Frequency-Max 140 kHz 200 kHz
Temperature Grade AUTOMOTIVE OTHER
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Input Voltage-Min 8 V
Input Voltage-Nom 8.5 V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.2 mm
Technology BICMOS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare TNY263P with alternatives

Compare TEA1622P/N1,112 with alternatives