TP3070V-G/NOPB
vs
TP3070V-XG
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, LCC-28
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Companding Law |
A/MU-LAW
|
A/MU-LAW
|
Filter |
YES
|
YES
|
Gain Tolerance-Max |
0.15 dB
|
0.15 dB
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
e0
|
Length |
11.43 mm
|
11.43 mm
|
Linear Coding |
NOT AVAILABLE
|
NOT AVAILABLE
|
Moisture Sensitivity Level |
3
|
3
|
Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
245
|
220
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Current-Max |
0.011 mA
|
0.013 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
PROGRAMMABLE CODEC
|
PROGRAMMABLE CODEC
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
3
|
2
|
|
|
|
Compare TP3070V-G/NOPB with alternatives
Compare TP3070V-XG with alternatives