TP3070V-XG/NOPB
vs
TS5071N
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
STMICROELECTRONICS
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, DIP-20
|
| Pin Count |
28
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Companding Law |
A/MU-LAW
|
A/MU-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
0.15 dB
|
0.15 dB
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.43 mm
|
25.15 mm
|
| Linear Coding |
NOT AVAILABLE
|
NOT AVAILABLE
|
| Moisture Sensitivity Level |
3
|
|
| Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
20
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
DIP20,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
3.93 mm
|
| Supply Current-Max |
0.013 mA
|
11 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PROGRAMMABLE CODEC
|
PROGRAMMABLE CODEC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.43 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare TP3070V-XG/NOPB with alternatives
Compare TS5071N with alternatives