TP3404V/NOPB
vs
TSS933EBM883
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEMIC SEMICONDUCTORS
|
| Package Description |
PLASTIC, LCC-28
|
LCC-28
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Data Rate |
144 Mbps
|
|
| ISDN Access Rate |
BASIC
|
|
| JESD-30 Code |
S-PQCC-J28
|
S-XQCC-J28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.43 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output High Voltage-Min |
2.4 V
|
|
| Output Low Current-Max |
0.001 A
|
|
| Output Low Voltage-Max |
0.4 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
QCCJ
|
QCCN
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LCC28,.45SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Point |
U
|
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TIME SLOT ASSIGNER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.43 mm
|
|
| Base Number Matches |
3
|
2
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Technology |
|
BICMOS
|
|
|
|
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