TPA0132PWPR
vs
MAX9750CEUI
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
HTSSOP-24
|
4.40 MM, MO-153AE, TSSOP-28
|
| Pin Count |
24
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| Harmonic Distortion |
10%
|
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G28
|
| JESD-609 Code |
e4
|
e0
|
| Length |
7.8 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Channels |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP24,.25
|
TSSOP28,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.1 mm
|
| Supply Current-Max |
15 mA
|
29 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
3
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare TPA0132PWPR with alternatives
Compare MAX9750CEUI with alternatives