TPA2005D1DGNG4
vs
LM4667ITLX/NOPB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
MSOP
|
|
Package Description |
HTSSOP, TSSOP8,.19
|
GREEN, DSBGA-9
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Bandwidth-Nom |
20 kHz
|
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Harmonic Distortion |
10%
|
2%
|
JESD-30 Code |
S-PDSO-G8
|
S-PBGA-B9
|
JESD-609 Code |
e4
|
e1
|
Length |
3 mm
|
1.5145 mm
|
Moisture Sensitivity Level |
1
|
1
|
Noise Figure-Nom |
97 dB
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.4 W
|
1.3 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP8,.19
|
BGA9,3X3,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.675 mm
|
Supply Current-Max |
4.5 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
1.5145 mm
|
Base Number Matches |
1
|
1
|
Gain |
|
12 dB
|
|
|
|
Compare TPA2005D1DGNG4 with alternatives
Compare LM4667ITLX/NOPB with alternatives