TPA2011D1YFFR vs MAX9712ETB feature comparison

TPA2011D1YFFR Texas Instruments

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MAX9712ETB Maxim Integrated Products

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MAXIM INTEGRATED PRODUCTS INC
Part Package Code BGA DFN
Package Description DSBGA-9 HVSON, SOLCC10,.11,20
Pin Count 9 10
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Texas Instruments
Bandwidth-Nom 20 kHz 22 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
JESD-30 Code S-XBGA-B9 S-XDSO-N10
JESD-609 Code e1 e0
Length 1.6 mm 3 mm
Moisture Sensitivity Level 1 1
Noise Figure-Nom 95 dB
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 9 10
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 3.2 W 0.7 W
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VFBGA HVSON
Package Equivalence Code BGA9,3X3,16 SOLCC10,.11,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 0.8 mm
Supply Current-Max 2.5 mA 5.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL NO LEAD
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.6 mm 3 mm
Base Number Matches 1 4
Gain 12.04 dB
Technology BICMOS

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