TPA2011D1YFFR
vs
MAX98300ETA+
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
SON
|
| Package Description |
DSBGA-9
|
HVSON, SOLCC8,.08,20
|
| Pin Count |
9
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| JESD-30 Code |
S-XBGA-B9
|
S-PDSO-N8
|
| JESD-609 Code |
e1
|
e3
|
| Length |
1.6 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Noise Figure-Nom |
95 dB
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
3.2 W
|
2.6 W
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVSON
|
| Package Equivalence Code |
BGA9,3X3,16
|
SOLCC8,.08,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.625 mm
|
0.8 mm
|
| Supply Current-Max |
2.5 mA
|
2 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.6 mm
|
2 mm
|
| Base Number Matches |
1
|
2
|
| Technology |
|
CMOS
|
|
|
|
Compare TPA2011D1YFFR with alternatives
Compare MAX98300ETA+ with alternatives