TPA2011D1YFFR vs TPA0211DGN feature comparison

TPA2011D1YFFR Texas Instruments

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TPA0211DGN Texas Instruments

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA MSOP
Package Description DSBGA-9 GREEN, PLASTIC, MSOP-8
Pin Count 9 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Bandwidth-Nom 20 kHz 20 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 Code S-XBGA-B9 S-PDSO-G8
JESD-609 Code e1 e4
Length 1.6 mm 3 mm
Moisture Sensitivity Level 1 1
Noise Figure-Nom 95 dB 93 dB
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 9 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 3.2 W 2 W
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA HTSSOP
Package Equivalence Code BGA9,3X3,16 TSSOP8,.19
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 1.1 mm
Supply Current-Max 2.5 mA 6 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER NICKEL PALLADIUM GOLD SILVER
Terminal Form BALL GULL WING
Terminal Pitch 0.4 mm 0.65 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 3 mm
Base Number Matches 1 4
Gain 2.5 dB
Harmonic Distortion 1%
Technology CMOS

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Compare TPA0211DGN with alternatives