TPA3001D1PWPG4
vs
TPA3001D1PWP
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
HTSSOP, TSSOP24,.25
|
HTSSOP-24
|
Pin Count |
24
|
24
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
36 dB
|
36 dB
|
JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
JESD-609 Code |
e4
|
e4
|
Length |
7.8 mm
|
7.8 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
20 W
|
20 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
HTSSOP
|
Package Equivalence Code |
TSSOP24,.25
|
TSSOP24,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
15 mA
|
15 mA
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
4
|
|
|
|
Compare TPA3001D1PWPG4 with alternatives
Compare TPA3001D1PWP with alternatives