TPA301DGN
vs
IS31AP4066D-QFLS2-TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
MSOP
|
QFN
|
| Package Description |
GREEN, PLASTIC, MSOP-8
|
QFN-16
|
| Pin Count |
8
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Integrated Silicon Solution Inc.
|
| Bandwidth-Nom |
20 kHz
|
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| Gain |
21.6 dB
|
|
| Harmonic Distortion |
0.5%
|
|
| JESD-30 Code |
S-PDSO-G8
|
S-XQCC-N16
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
0.35 W
|
1.6 W
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP8,.19
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.85 mm
|
| Supply Current-Max |
1.5 mA
|
10 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
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