TPA3100D2RGZRG4
vs
TPA3107D2PAPTG4
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFP
|
Package Description |
HVQCCN, LCC44,.28SQ,20
|
HTFQFP, QFP64,.47SQ,20
|
Pin Count |
48
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
36 dB
|
36 dB
|
JESD-30 Code |
S-PQCC-N48
|
S-PQFP-G64
|
JESD-609 Code |
e4
|
e4
|
Length |
7 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
21.8 W
|
15 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HTFQFP
|
Package Equivalence Code |
LCC48,.27SQ,20
|
QFP64,.47SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
26 V
|
26 V
|
Supply Voltage-Min (Vsup) |
10 V
|
10 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
7 mm
|
10 mm
|
Base Number Matches |
1
|
1
|
Supply Current-Max |
|
26.5 mA
|
|
|
|
Compare TPA3100D2RGZRG4 with alternatives
Compare TPA3107D2PAPTG4 with alternatives