TPA3121D2PWPRG4
vs
TAS5601DCA
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
TSSOP, TSSOP24,.25
|
HTSSOP-56
|
| Pin Count |
24
|
56
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G56
|
| JESD-609 Code |
e4
|
e4
|
| Length |
7.8 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
15 W
|
20 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HTSSOP
|
| Package Equivalence Code |
TSSOP24,.25
|
TSSOP56,.3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Current-Max |
30 mA
|
60 mA
|
| Supply Voltage-Max (Vsup) |
26 V
|
26 V
|
| Supply Voltage-Min (Vsup) |
10 V
|
10 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
6.1 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Bandwidth-Nom |
|
20 kHz
|
| Noise Figure-Nom |
|
99 dB
|
|
|
|
Compare TPA3121D2PWPRG4 with alternatives
Compare TAS5601DCA with alternatives