TPA3126D2DADR
vs
TDA7360
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
STMICROELECTRONICS
|
| Package Description |
TSSOP-32
|
ZIP, ZIP11,.2,.17,67TB
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
STMicroelectronics
|
| Bandwidth-Nom |
22 kHz
|
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
26 dB
|
20 dB
|
| JESD-30 Code |
R-PDSO-G32
|
R-PZFM-T11
|
| JESD-609 Code |
e4
|
e3
|
| Length |
11 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Noise Figure-Nom |
102 dB
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
32
|
11
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Power-Nom |
50 W
|
12 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
ZIP
|
| Package Equivalence Code |
TSSOP32,.3
|
ZIP11,.2,.17,67TB
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
26 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
8 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
1.7 mm
|
| Terminal Position |
DUAL
|
ZIG-ZAG
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6.1 mm
|
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
ZFM
|
| Pin Count |
|
11
|
| Harmonic Distortion |
|
10%
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
120 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare TPA3126D2DADR with alternatives
Compare TDA7360 with alternatives