TPA3139D2RGER
vs
TEA2025D013TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
STMICROELECTRONICS
|
| Package Description |
HVQCCN,
|
SOP, SOP16,.25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Date Of Intro |
2019-10-21
|
|
| Samacsys Manufacturer |
Texas Instruments
|
STMicroelectronics
|
| Bandwidth-Nom |
20 kHz
|
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
26 dB
|
45 dB
|
| JESD-30 Code |
S-PQCC-N24
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
4 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Noise Figure-Nom |
102 dB
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-10 °C
|
|
| Output Power-Nom |
10 W
|
2.8 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
14.4 V
|
12 V
|
| Supply Voltage-Min (Vsup) |
3.5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Harmonic Distortion |
|
10%
|
| Package Equivalence Code |
|
SOP16,.25
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
50 mA
|
|
|
|
Compare TPA3139D2RGER with alternatives
Compare TEA2025D013TR with alternatives