TPA3140D2PWP
vs
TPA3137D2PWPR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TSSOP-28
|
TSSOP-28
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Bandwidth-Nom |
22 kHz
|
22 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| Gain |
23 dB
|
26 dB
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| JESD-609 Code |
e4
|
e4
|
| Length |
9.7 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Noise Figure-Nom |
102 dB
|
102 dB
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
10 W
|
6 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
HTSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
14.4 V
|
14.4 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| Date Of Intro |
|
2016-06-20
|
| Supply Current-Max |
|
40 mA
|
|
|
|
Compare TPA3140D2PWP with alternatives
Compare TPA3137D2PWPR with alternatives