TPA6130A2RTJTG4
vs
TPA6140A2YFFT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
BGA
|
Package Description |
HVQCCN, LCC20,.16SQ,20
|
1.6 X 1.6 MM, 0.4 MM PITCH, GREEN, DSBGA-16
|
Pin Count |
20
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
Harmonic Distortion |
1%
|
10%
|
JESD-30 Code |
S-PQCC-N20
|
S-PBGA-B16
|
JESD-609 Code |
e4
|
e1
|
Length |
4 mm
|
1.905 mm
|
Moisture Sensitivity Level |
2
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
0.138 W
|
0.025 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VFBGA
|
Package Equivalence Code |
LCC20,.16SQ,20
|
BGA16,4X4,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.625 mm
|
Supply Current-Max |
6 mA
|
2 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
4 mm
|
1.905 mm
|
Base Number Matches |
1
|
1
|
Channel Separation |
|
80 dB
|
|
|
|
Compare TPA6130A2RTJTG4 with alternatives
Compare TPA6140A2YFFT with alternatives