TPA6130A2YZHR
vs
BD3830FS-E2
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROHM CO LTD
|
Part Package Code |
BGA
|
SSOP
|
Package Description |
DSBGA-16
|
SSOP,
|
Pin Count |
16
|
32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
TONE CONTROL CIRCUIT
|
Harmonic Distortion |
1%
|
0.005%
|
JESD-30 Code |
S-XBGA-B16
|
R-PDSO-G32
|
JESD-609 Code |
e1
|
|
Length |
2.29 mm
|
13.6 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
0.138 W
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SSOP
|
Package Equivalence Code |
BGA16,4X4,20
|
SOP32,.3,32
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.625 mm
|
1.9 mm
|
Supply Current-Max |
6 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
9.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
2.29 mm
|
5.4 mm
|
Base Number Matches |
1
|
1
|
Channel Separation |
|
80 dB
|
Number of Bands |
|
2
|
|
|
|
Compare TPA6130A2YZHR with alternatives
Compare BD3830FS-E2 with alternatives