TPA6203A1DRBR
vs
MAX9712ETB-T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SON
|
DFN
|
Package Description |
3 X 3 MM, GREEN, PLASTIC, SON-8
|
HVSON, SOLCC10,.11,20
|
Pin Count |
8
|
10
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Bandwidth-Nom |
20 kHz
|
22 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Harmonic Distortion |
1%
|
|
JESD-30 Code |
S-PQCC-N8
|
S-XDSO-N10
|
JESD-609 Code |
e4
|
e0
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
1
|
Noise Figure-Nom |
104 dB
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.25 W
|
0.7 W
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVSON
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Gain |
|
12.04 dB
|
Package Equivalence Code |
|
SOLCC10,.11,20
|
Supply Current-Max |
|
5.2 mA
|
|
|
|
Compare TPA6203A1DRBR with alternatives
Compare MAX9712ETB-T with alternatives