TPA6205A1NMBR
vs
TPA6211A1DRBR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
NFBGA-8
|
3 X 3 MM, GREEN, PLASTIC, SON-8
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
Harmonic Distortion |
1%
|
10%
|
JESD-30 Code |
S-PBGA-B8
|
S-PDSO-N8
|
JESD-609 Code |
e1
|
e4
|
Length |
2 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
2
|
Noise Figure-Nom |
104 dB
|
105 dB
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.25 W
|
3.1 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVSON
|
Package Equivalence Code |
BGA8,3X3,20
|
SOLCC8,.12,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Current-Max |
2 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
2 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SON
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare TPA6205A1NMBR with alternatives
Compare TPA6211A1DRBR with alternatives